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Product category: Heatsinks and Thermal Management
News Release from: Rutronik Elektronische Bauelemente | Subject: Balkhausen foils
Edited by the Electronicstalk Editorial Team on 13 October 2006

Franchise adds foils to thermal
management options

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Rutronik has signed a pan-European franchise with Balkhausen, the leading manufacturer of thermal management products.

Rutronik Elektronische Bauelemente has further extended its thermal management portfolio by signing a pan-European franchise with Balkhausen, a Division of Brady, the leading manufacturer of thermal management products Under the Transtherm brand, Balkhausen offers thermally conducting materials for heat dissipation, insulation, gluing and bridging gaps for thermal management in electronics

Balkhausen expects deep market penetration in Europe through the large customer potential and the solid technical competence of Rutronik.

With this agreement, Rutronik rounds out its product range of thermally conducting foils, above all in view of its latest thermal management campaign with courses and technical support in application development.

This broadline distributor supports its customers with thermal management through technical application support and its well co-ordinated product range from the following manufacturers: Balkhausen, 3M, Assmann, Adda, T and T, YS Tech, Delta and United Pro.

Other partners are Andus and Thermacore Europe.

Transtherm thermally conducting foils are used on the separation surfaces between the heat-producing components and the heatsinks in order to minimise the thermal resistance.

Every electrical process is accompanied by losses which are released in the form of heat.

Critical temperatures lead unavoidably to premature failure of the component and to higher costs as a result.

The heat-conducting foils reduce the thermal resistance between the component and the heatsink through an improvement of the surface contact and promote the cooling of the component in this way.

They adapt to unevenness of the surfaces pressing into each other and exclude air from the surface between them.

The self-adhesive foils are distinguished by a high temperature resistance and are used when components are glued to heatsinks and power transistors.

"Thermal management is a competitive factor which must be taken into account from the beginning in development work".

"Ignoring it can lead to shocking disadvantages in competition, such as increased costs and loss of time with the product launch", are says Jorg Ciper, Business Unit Manager Electromechanics at Rutronik.

For this reason, this year Rutronik initiated a thermal management campaign in close co-operation with its manufacturers, which made customers and others aware of the high sensitivity of this topic through the transfer of knowledge and technical advice.

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