Product category:
Design and Development Software
News Release from: Raytheon Reliability Analysis Lab | Subject: Reliability Analysis News
Edited by the Electronicstalk Editorial
Team on 22 February 2002
Newsletter looks at reliability
The latest edition of Reliability Analysis News, a newsletter for design engineers, testing laboratories, and manufacturing organisations, is now available.
Raytheon Company's Reliability Analysis Laboratory's (RAL) newest edition of Reliability Analysis News, a newsletter for design engineers, testing laboratories, and manufacturing organisations, is now available Reliability Analysis News provides up-to-date information on a variety of techniques, methods, and approaches for evaluating and analysing electronic parts and semiconductor components
This article was originally published on Electronicstalk on 14 Dec 2001 at 8.00am (UK)
Related stories
Online service for component reliability data
ReliabilityAnalysisLab.com (RAL) provides its customers with 24x7 access to product reliability reports and in-process analyses performed by the lab on a wide range of electronic products.
The Winter 2002 edition of Reliability Analysis News provides an overview of the RAL's most recent work in microelectronics packaging, nonlinear transistor heating, voltage contrast, and electromigration.
Specific tutorials include, "Heat: the enemy of ICs", "Applying voltage contrast to a GaAs MMIC", and "Failures in microelectronics packaging".
A discussion of contamination on printed circuit boards looks at the effect on push-button switches.
"Recent failure analysis findings from the lab" summarises a variety of component failures analysed by the RAL; the latest series of tests uncovered supplier problems related to poor workmanship and inadequate inspection.
Industry pundit Howard Dicken rounds out the Winter 2002 edition by providing insight into using high-voltage/high-current devices in his article, "Dual reliability problems of high voltage devices".
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