Product category:
PCB Connectors
News Release from: Samtec | Subject: Q-UP high-speed interfaces
Edited by the Electronicstalk Editorial
Team on 27 September 2001
Elevated high-speed interface options
Samtec now offers an expanded choice of micro pitch interfaces for matched impedance and high-speed applications that require elevated designs with board spacings greater than 16mm. usuall
Samtec now offers an expanded choice of micro pitch interfaces for matched impedance and high-speed applications that require elevated designs with board-to-board spacings greater than the 16mm usually required for clearing common heatsink profiles Samtec's Q-UP high-speed interfaces are available with 19, 22, 25 and 30mm board spacings
These are frequently used in hubs, bridges, routers and data storage systems where increased ventilation and air circulation is required.
Full surface mount designs are available on 0.8mm pitch (QTE Series) and 0.5mm pitch (QTH Series), while mixed-technology design on 0.635mm pitch (MIT Series) with through-hole ground plane and surface mount signal pins is available with 18.75 and 22mm stack heights.
These Samtec high speed interconnects are fully tested for 50ohm systems for impedance, VSWR, attenuation, crosstalk, propagation delay and rise time.
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