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Product category: CompactPCI Boards and Assemblies
News Release from: Schroff UK | Subject: Rigid CompactPCI backplanes
Edited by the Electronicstalk Editorial Team on 24 February 2000

More rigid backplanes keep availability
high

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Stiffening rails add reinforcement to Schroff's new 64-bit 6U CompactPCI backplanes.

Providing full Hot Swap capability, Schroff's new 64-bit 6U CompactPCI backplanes are the ideal solution for applications requiring high availability in telecommunications, automation and industrial control CompactPCI connectors have a very high pin density and are subject to forces of up to around 500N when the board is being inserted or removed from a subrack

Consequently a very high degree of rigidity is required, particularly in relation to the board's hot swap pins which are of differing lengths.

Schroff's solution is to incorporate stiffening rails.

These add the necessary reinforcement to the backplanes which are only 3.2mm thick, so that any bending during removal and insertion is on average less than 0.5mm.

Schroff's backplanes include four, five and eight-slot versions, all with ten-layer optimised layouts and clock signals with identical signal running times.

The standard I/O voltage of +5V can be converted to 3.3V where necessary, while voltage delivery is via press fit/screw connection, ATX or PS/2 connectors.

In order to reduce cabling to a minimum, the backplanes can be equipped with power connectors to fit most modern power supplies.

All backplanes are live insertion compatible (Hot Swap) and may he used with Schroff's latest High Leverage Self-Locking (HLS) injector/extractor handles.

CPCI combines the advantages of proven PC technology with the robustness of 19" systems.

The PCI bus, as used in many offices today, has been coupled with a rugged subrack to produce a low cost, reliable alternative to VME.

Basing CPCI on standard PC technology ensures hardware and software is both well supported competitively priced.

Over the next few years, it is predicted that CPCI will become the de-facto microcomputer packaging systems standard in telecommunications, network and data systems, automation and control, traffic and medical systems around the world.

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