Product category:
Instrument Cases, Benchtop and Wall-Mounting Enclosures
News Release from: Schroff UK | Subject: Packaging solutions for AdvancedTCA
Edited by the Electronicstalk Editorial
Team on 12 February 2003
Packaging solutions for AdvancedTCA
Schroff has released a full-colour four-page catalogue detailing the new line of packaging solutions for AdvancedTCA, the forthcoming PICMG 3.0 specification.
Schroff has released a full-colour four-page catalogue detailing the new line of packaging solutions for AdvancedTCA, the forthcoming PICMG 3.0 specification being developed by the PCI Industrial Computers Manufacturers Group (PICMG) The new catalogue includes features and technical specifications for Schroff's new ATCA backplane and 12U development system, both available in 14-slot, full mesh configurations, as well as the new ATCA CompactPCI 2.16 adapter board, front panels for both front and rear boards, and filler panels for covering empty chassis slots
This article was originally published on Electronicstalk on 3 Feb 2000 at 8.00am (UK)
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AdvancedTCA, PICMG's designation for the PICMG 3.x family of draft specifications, is an open, multivendor architecture designed to provide extremely high processor density and communications bandwidth, augmented with robust mechanical and electrical definitions.
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