Product category:
Instrument Cases, Benchtop and Wall-Mounting Enclosures
News Release from: Schroff UK | Subject: AdvancedTCA housings
Edited by the Electronicstalk Editorial
Team on 15 June 2005
AdvancedTCA housings survive shock
testing
Having undergone rigorous testing in Munich, all Schroff's AdvancedTCA systems live up to the shock, vibration and earthquake requirements of the GR-63-Core standard.
The use of AdvancedTCA systems in the USA and Japan demands shock, vibration and earthquake testing to GR-63-Core as the systems are often exposed to considerable environmental strains due to the nature of these regions Having undergone rigorous testing in Munich, all Schroff's AdvancedTCA systems live up to these requirements
This article was originally published on Electronicstalk on 3 Feb 2000 at 8.00am (UK)
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A fully assembled AdvancedTCA system with 14 x 3kg plug-in units, loaded at the front and a 14 x 400g loaded at the rear was tested.
Half of the plug-in units had aluminium front plates whereas the other half had standard sheet metal front plates.
The test results can be downloaded from the Schroff website.
Schroff's AdvancedTCA systems satisfy a multitude of other demands including climate control and EMC.
The carefully planned cooling concept provides balanced cooling for the assembled plug-in units, even when one of the fans fails.
To guarantee a reliable and cost effective temperature and shelf management solution, all AdvancedTCA systems are equipped with two redundant shelf management controllers, which include both the temperature control and shelf management function on one board.
This allows high flexibility of the programmable fan controller, which is very useful when the cooling concept has to be adapted to different applications.
The topology of the integrated backplanes can be realised in different ways with these complete systems.
Simple solutions are available with dual star or dual dual star (redundant dual star), as well as full mesh (where each slot is connected with each other via a channel).
The backplanes correspond to the high speed demands of the next board generation with 3.125Gbit/s and more.
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