Product category:
Electronics Manufacturing Services
News Release from: Schroff UK | Subject: Systems integration
Edited by the Electronicstalk Editorial
Team on 18 October 2005
Packaging hosts full systems integration
Schroff has developed new systems integration capabilities that include complete assembly and test of electromechanical and electronic components.
Electronic packaging is now more than just supplying empty cabinets and cases Schroff has developed new systems integration capabilities that include complete assembly and test of electromechanical and electronic components, such as cabling, switches, backplanes, power supplies, monitoring units, cooling concepts and EMC measures in an electronics cabinet or case
This article was originally published on Electronicstalk on 3 Feb 2000 at 8.00am (UK)
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In a new 8-page brochure the customer can view the different integration levels, the European integration centres and the services provided by Schroff in the area of electronic packaging.
The starting point of any integration project is based on the requirements described in the customer specification.
Schroff looks after its customers from the time of the specification and construction via sales, prototyping, tests and preproduction trials up to the actual production including logistics.
Customers profit from the fact that they deal with only one supplier and only one order covering the entire enclosure system.
This provides them with the opportunity to concentrate more intensively on their own core competences.
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