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Instrument Cases, Benchtop and Wall-Mounting Enclosures
News Release from: Schroff UK | Subject: MicroTCA systems
Edited by the Electronicstalk Editorial
Team on 06 March 2006
MicroTCA systems host up to 12 modules
Based on the new PICMG standard, Schroff has developed a complete product range of MicroTCA systems.
MicroTCA is a modular platform for the development of telecommunications, business and network applications The PICMG MicroTCA standard, for which Schroff led the development of the mechanics, defines a system where mezzanine boards (AdvancedMCs) are assembled directly on a backplane
This article was originally published on Electronicstalk on 3 Feb 2000 at 8.00am (UK)
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Outside the telecommunications sector, MicroTCA systems have the potential to replace proprietary solutions and reduce development costs with their flexible and modular design.
Based on this new standard Schroff has developed a complete product range of MicroTCA systems.
The systems are available with 2 and 4U-high board cages, are 200mm deep and come in various widths.
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The systems consist of a chassis, a MicroTCA carrier hub (optionally two for redundant operation), power modules with selectable redundancy and load distribution, a cooling unit (optionally redundant) and a backplane.
The backplane is configured in star topology and with its high speed connections suitable for different protocols.
If required each systems can be upgraded with cooling units.
The basic configuration of an assembled MicroTCA system consists of an AdvancedTCA module, a MicroTCA carrier hub, a backplane and a power supply.
In the largest MicroTCA system offered by Schroff, 12 AdvancedMC modules can be assembled.
During the development of the MicroTCA systems particular attention was paid to cooling concepts.
Based on the heat generated by the processors, the standard allows a maximum heat loss of 80W per AdvancedMC module.
For more demanding cooling requirements, Schroff has integrated liquid cooling in its MicroTCA platform systems.
With direct cooling of the area where the heat is created, ie direct cooling of the AMC modules, Schroff has created a hybrid solution, combining water and air cooling in the chassis.
The critical components on the board are cooled directly with water cooling units.
The heat generated by the remaining electronic components on the board, can easily be expelled with conventional air cooling.
Above and below the board cage is a distribution system, from which the slots of the MicroTCA systems can be supplied with cooling fluid.
The inlet and outlet pipes for the water cooling units on the boards are lead to the front to drip-free valves in the front panel of the plug-in unit.
The high availability required by such systems is enhanced by redundant cooling.
This means that the failure of a fan does not interrupt the operation of the system.
Furthermore the systems meet the requirements of both US NEBS (Network Equipment Building Standard) and European ETSI standards with their strict limits for noise generation.
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