Product category:
Boards and Backplanes
News Release from: Schroder-Plast | Subject: 3D-MID
Edited by the Electronicstalk Editorial
Team on 12 November 2003
Novel approach to 3D circuitry
A technology breakthrough has opened a new low-cost and rapid method for manufacturing single prototypes and short runs of both flat and 3D-formed printed circuit boards.
A technology breakthrough has opened a new low-cost and rapid method for manufacturing single prototypes and short runs of both flat and 3D-formed printed circuit boards The new technology is based on thermoplastic bodies, manufactured by free forming, such as selective laser sintering (SLS) or fused deposit modelling (FDM)
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
Related stories
Punch down and earth strap for connector
The RJ-LnxxT IP67 rated, sealed, industrial RJ-45 connectors, available in the UK from Aerco, are now available with IDC punch down and earth strap terminations.
The metal circuits are applied by metal foil hot embossing.
The foils can range in thicknesses from 10 to more than 100um.
A range of plastics can be used with up to +250C temperature resistance.
Linewidths can be manufactured from 0.2mm and upwards, and the clearance between circuits may be as close as 0.2mm.
The only geometric limitation in 3D is no sharp corners.
The new technology allows new concepts in electronics design.
Instead of using conventional printed circuit boards it is now possible to incorporate electronics in plastics with other functions.
This can save component numbers, weight and cost, increasing reliability and giving designers more freedom.
• Schroder-Plast: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
