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News Release from: SEMI
Edited by the Electronicstalk Editorial
Team on 27 April 2007
Manufacturing advances in Semicon focus
This year's Semicon West in San Francisco will focus on topics that are revolutionising the advanced manufacturing world
Semicon West, the world's most comprehensive event dedicated to the global semiconductor and microelectronics manufacturing supply chains, will return to the Moscone Center in San Francisco, California the week of 16th to 20th July 2007 Presentations at this year's exposition will focus on a range of topics that are revolutionising the advanced manufacturing world including new opportunities for high-K materials, the solar energy market and innovative advances in design for manufacturing
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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The following executives will be delivering keynotes at Semicon West: Douglas Grose, SVP of Technology Development, Manufacturing and Supply Chain, AMD; Paolo Gargini, Intel Fellow, Technology and Manufacturing and Group Director, Technology Strategy, Intel; TJ Rodgers, chairman, SunPower Corporation and Chairman, CEO and Director, Cypress Semiconductor; Rhone Resch, President, Solar Energy Industries, Association (SEIA); and Aart de Geus, Chairman and CEO, Synopsys.
"The most exciting developments in the industry are taking place at Semicon West 2007, and virtually every global equipment and material supplier will be participating", said Victoria Hadfield, President of SEMI North America.
"Visitors can expect to see more than 200 new product introductions, the latest ITRS updates and discussions, and learn about the most innovative new technological developments, which could move the industry past 45nm and CMOS".
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The TechXpots ("tech spots"), which are essentially shows-within-the-show, feature a combination of exhibits, live technical content, and presentations by the winners of the Technology Innovation Showcase (TIS), as well as special interactive displays.
This year's TechXpots include Emerging Technologies and Markets, Test Assembly and Packaging and Challenges in Device Scaling.
Solutions for effectively modelling nano particles, new ultrastable systems for producing solar energy and products that enable high-volume manufacture of advanced micro and nano structures will be featured in the Emerging Technologies and Markets TechXpot.
The Test, Assembly and Packaging area will highlight new organic packaging technologies, software suites that enable accelerated yield ramps or deliver fully automated 2D/3D inspection that ensure production speed and accuracy.
Innovations that reduce gate leakage, provide atomic level process control and software designed to analyse fab data and improve wafer yields will be found in the Challenges in Device Scaling TechXpot.
In total, the TechXpots will feature more than 30 hours of content focused on innovations key to reshaping the face of the industry, and will be free to Semicon West 2007 delegates.
In addition to the comprehensive program, this year's exposition will feature the International Technology Roadmap for Semiconductors (ITRS) discussion, which for the first time will be held on the Semicon West 2007 show floor.
Semicon West 2007 will feature well over 1000 exhibiting companies, representing 23 countries.
In 2006, more than 40,000 people registered for the show, making it the largest microelectronics technology exposition in the North America.
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