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News Release from: SEMI
Edited by the Electronicstalk Editorial
Team on 10 May 2007
Showcase for technology innovation
SEMI has announced its Technology Innovation Showcase Award winners in three categories: Emerging Technologies, Wafer Processing and Test, Assembly and Packaging.
SEMI has announced its Technology Innovation Showcase Award winners for 2007 Nineteen award winners make up the 5th annual showcase, and will deliver exclusive presentations in the various TechXpots during Semicon West 2007
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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This year's recipients are grouped into three categories: Emerging Technologies, Wafer Processing and Test, Assembly and Packaging.
They were selected by a jury of industry experts based on technical merit, commercialisation potential, as well as the potential impact the innovation will have on the semiconductor and related industries.
Companies in the Emerging Technologies category feature diamond on silicon substrates, an EUV light source, software that models the electrical properties of nanoscale systems, a small atomic force microscope for production and diagnostic applications, a new process for copper interconnects, and a high volume imprint lithography system for advanced micro and nanostructures based on nanoimprint lithography (NIL) among others.
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The Test, Assembly and Packaging category innovations include technology for advanced organic packaging, an automated 2D/3D inspection system, a high- speed electrolytic plating process, an integrated tool set used to enable accelerated yield ramps, and a vertical probe card for advanced flip chip devices.
In the Wafer Processing category companies are introducing test wafers with 45nm arrays, variable batch ALD systems, environmentally friendly removal chemistry, an XPS-based product wafer thin-film metrology system, a system to measure offsets and teach wafer transfer systems, and software tools for automatic physical layout optimisation.
"For the past three years, the Innovation Showcase has helped to highlight companies with significant new products that may change the micro- and nanoelectronics industries", said Victoria Hadfield, President of SEMI North America.
"Our goal is to speed these innovations to market by assisting winners in the identification of potential customers, partners and funding sources".
TIS winners will discuss their new technologies at the TechXpot stages during Semicon West 2007.
TechXpots are "shows-within-the-show" that feature exhibits, products and free live technical presentations for visitors at Semicon West.
Emerging Technologies and Markets winners were: Advanced Diamond Technologies, Atomistix, Energetiq, Karma Technology, Nano Cluster Devices and Obducat.
Test, Assembly and Packaging awards went to: Inovys Corporation, Jacket Micro Devices, SolVision, Surfect Technologies and Wentworth Laboratories.
Wafer Processing winners were: ATDF, Aviza Technologies, CyberOptics, EKC Technology, GE Sensing, Mears Technologies, ReVera and Takumi Technology Corp.
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