Product category:
Circuit Protection Devices
News Release from: Semtech | Subject: SFC3.3-4
Edited by the Electronicstalk Editorial
Team on 22 November 2001
Four in one for transient voltage
suppression
Semtech reckons its SFC3.3-4 low-voltage ChipClamp TVS (transient voltage suppressor) array is a breakthrough ESD-protection device for portable and low-operating-voltage electronics.
Semtech reckons its SFC3.3-4 low-voltage ChipClamp TVS (transient voltage suppressor) array is a breakthrough ESD-protection device for portable and low-operating-voltage electronics The SFC3.3-4 is the industry's first TVS device to marry a 3.3V working voltage with space-saving flip-chip packaging to yield unprecedented mechanical and electrical performance
This article was originally published on Electronicstalk on 16 Jul 2001 at 8.00am (UK)
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The quad array protects four separate data or I/O lines squarely matches the key design requirements of a wide range of low-voltage and portable electronic products, including cellular phones, personal digital assistants, notebook and handheld computers, portable instrumentation, pagers, "smart" cards, and MP3 players.
According to Tom Dugan, Semtech's Director of Marketing for Protection Products, "The IC technology trend to 0.18um and below CMOS fabrication has forced down operating voltages while increasing susceptibility to damage from electrostatic discharge (ESD) and other voltage transients.
Breakdown voltages for gate oxides are approaching a few tens of volts while tight space and low-power requirements continue to challenge equipment designers.
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Fortunately, the SFC3.3-4, with its unique combination of 3.3V operating voltage and flip-chip packaging, gives designers an effective answer to these vexing dilemmas".
In particular, by offering a quad array in a 0.5mm-pitch flip-chip package, the SFC3.3-4 gives equipment designers space saving technology for meeting tight mechanical constraints.
Compared to an SC70 package, which requires 9mm2 of board space, the 1 x 1.5mm flip chip occupies only 1.5mm2.
It also has a lower profile less than 0.65mm and needs no underfill material.
Moreover, the flip chip design offers improved electrical performance over conventional packages by virtually eliminating parasitic inductance caused by leads and bond wires.
The result is virtually none of the voltage overshoot that acts to raise clamping voltage.
As for its industry leading 3.3V operating voltage, the SFC3.3-4 achieves this key value without making any performance compromises.
Competitive circuit protection devices use a reverse avalanche phenomenon and suffer performance degradations below 5V operating voltages.
Specifically, where Zener diodes and other pn-junction devices introduce unacceptably high junction capacitance and leakage currents, the SFC3.3-4, a complex four-layer nppn device built on Semtech's proprietary EPD fabrication process, maintains superior clamping performance and DC electrical characteristics.
For example, because the EPD process and four-layer structure clamp using a "punchthrough" rather than avalanche mechanism, the SFC3.3-4 produces a "snap back" effect that lowers the clamping voltage across the device.
The process and structure underlying SFC3.3-4 also account for its 0.05A (typical) reverse leakage current.
In comparison, the reverse leakage current of low-voltage silicon avalanche devices can reach several milliamps, making them a poor choice for battery operated equipment.
The SFC3.3-4 is rated to handle 200W of peak pulse power (tp=8/20us) and meets the protection requirements of IEC 61000-4-2 for ESD, IEC 61000-4-4 for EFT, and for IEC 61000-4-5 for lightning.
The SFC3.3-4 low-voltage ChipClamp TVS quad array is available now in tape and reel format.
Pricing starts at $0.34 each for production quantities of 10,000 pieces.
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