ESD protection device simplifies board layout

Edited by the Electronicstalk editorial team Sep 23, 2005

Semtech Corp has announced the uClamp3324P, a low-voltage, four-line electrostatic discharge (ESD) protection device that features packaging and design innovations for a simplified board layout.

Semtech Corp, a supplier of analogue and mixed-signal semiconductors for communications, portable devices, computers and industrial equipment, has announced the uClamp3324P, a low-voltage, four-line electrostatic discharge (ESD) protection device that features packaging and design innovations for an ultra-small size and simplified board layout.

Part of Semtech's MicroClamp ESD protection family, the uClamp3324P is a 3.3V device that comes in Semtech's new SLP2116P8 leadless package, which measures only 2.1 x 1.6 x 0.58mm.

The uClamp3324P has a flow-through design that enables it to be used near connectors, simplifying board design, compared with competitive multi-line ESD protection devices that require significant board redesign.

The uClamp3324P replaces four discrete devices such as multilayer varistors, reducing the space needed for ESD protection by 77%.

Internally, the device is constructed using Semtech's patented EPD TVS process technology yielding true 3.3 volt operating devices.

"This device is designed for the many portable systems that still rely on single-line discrete devices for protection solely because they are easier to lay out on the board", said Tom Dugan, Semtech's Director of Protection Products.

"Given that the power connector in today's cellphone designs can call for up to 24 lines of protection, the benefit of this new MicroClamp product in terms of board space savings is dramatic".

Designed for cellphones, digital still cameras, notebook computers and other portable systems, the uClamp3324P provides low working and clamping voltage for superior protection of sensitive ICs in high ESD threat environments.

The leadless design, along with a large ground pad at the bottom of the device reduces the parasitic inductance, for better IC protection.

The device exceeds the IEC protection standards for ESD and electrical fast transient (EFT) protection.

The lead-free design of the device meets worldwide environmental and regulatory requirements including the European Union's Restriction on Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive.