BGA packaging boosts RF relay performance

A new range of ball-grid-array (BGA) reed relays uses patented technology to provide leadless relay packages with enhanced RF performance.

A new range of ball-grid-array (BGA) reed relays uses patented technology to provide leadless relay packages with enhanced RF performance.

The signal path between input and output in the Coto BGA relays from Sequoia is designed as an RF transmission line, with an RF impedance close to 50ohm throughout the relay.

With either B10 or B40 BGA relays, the designer is able to switch or pass signals with wider bandwidth and faster rise time than alternate technologies.

BGA packaging allows relays to be easily integrated on boards designed for surface mount processing.

The B10 is a single channel Form A BGA that uses a minimum board space of only 0.1in2.

3.3 or 5V coils are standard and the RF insertion loss (-3dB rolloff point) is above 10GHz.

Single channel simplicity makes the B10 an economical choice for RF switching The B40 is a BGA with four independent form A channels in one quad package requiring only 0.215in2 of board space.

Both 3.3 and 5V coils are available and the RF insertion loss (-3dB rolloff point) is better than 11 GHz.

Interchannel RF crosstalk is minimised by a combination of coaxial and magnetic shielding.

Adjacent channel RF crosstalk is -25dB at 11GHz.

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