Product category:
Electromechanical Components
News Release from: Sequoia Technology | Subject: Coto BGA relays
Edited by the Electronicstalk Editorial
Team on 03 June 2004
BGA reed relays provide superior RF
performance
A new range of ball-grid-array (BGA) reed relays uses patented technology to provide leadless relay designs with enhanced RF performance.
A new range of ball-grid-array (BGA) reed relays uses patented technology to provide leadless relay designs with enhanced RF performance The signal path in the Coto BGA relays from Sequoia between input and output is designed as an RF transmission line, with an RF impedance close to 50ohm throughout the relay
This article was originally published on Electronicstalk on 22 Oct 2003 at 8.00am (UK)
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BGA packaging boosts RF relay performance
A new range of ball-grid-array (BGA) reed relays uses patented technology to provide leadless relay packages with enhanced RF performance.
With either B10 or B40 BGA relays, the designer is able to switch or pass signals with wider bandwidth and faster rise time than alternative technologies.
BGA packaging allows relays to be easily integrated on boards designed for surface mount processing.
The B10 is a single channel form A BGA that uses a minimum board space of only 0.1in2.
3.3 or 5V coils are standard and the RF insertion loss (-3dB rolloff point) is better than 10GHz.
Single channel simplicity makes B10 an economical choice for RF switching.
The B40 is a BGA with four independent form A channels in one quad package requiring only 0.215in2 of board space.
Both 3.3 and 5V coils are available and the RF insertion loss (-3dB roll-off point) is better than 11GHz.
Interchannel RF crosstalk is minimised by a combination of coaxial and magnetic shielding.
Adjacent channel RF crosstalk is -25dB at 11GHz.
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