Product category:
Discrete Power Devices
News Release from: Shindengen UK | Subject: DxKB80R
Edited by the Electronicstalk Editorial
Team on 30 May 2002
Enhanced packaging raises bridge diode
reliability
Shindengen's new bridge diodes feature an optimised leadframe construction for enhanced thermal radiation, to deliver improved reliability in service.
Shindengen's new bridge diodes feature an optimised leadframe construction for enhanced thermal radiation, to deliver improved reliability in service The Shindengen DKB series devices demonstrate excellent performance in switch mode power supplies for data storage, networking or A/V equipment, as well as motor controllers for washing machines, dryers, dishwashers and other appliances
This article was originally published on Electronicstalk on 17 Aug 2001 at 8.00am (UK)
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Conforming to industry standard package dimensions with 5.08mm pin separation to meet international isolation requirements, the Shindengen DKB series is currently undergoing approval to UL1557 standard covering isolation performance.
The new leadframe design occupies an increased proportion of the overall package volume, allowing heat to radiate more uniformly from the surface of the device.
Maximising radiation from the package surface area in this way improves heat dissipation efficiency, enabling improved junction temperature stability and thereby enhancing reliability and longevity.
There are three family members, rated at 4, 6 and 8A output current, all with forward voltage drop of 1V, all capable of withstanding 800V reverse voltage, peak surge forward current from 150A and with a lead-to-case isolation of 2.0kV.
The D4KB80R is rated for output currents up to 4A.
The D6KBA80R, rated up to 6A forward current, and D8KBA80R rated up to 8A complete Shindengen's DKB series enhanced bridge diode lineup.
All are available in industry standard packages.
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