Product category:
IC and Hybrid Processing Equipment
News Release from: Shipley Europe | Subject: ultraDirect 700
Edited by the Electronicstalk Editorial
Team on 09 April 2001
Universal dry film resist for laser
direct imaging
Shipley has launched the latest in its series of ultraDirect laser direct imaging (LDI) dry film photoresists.
Shipley has launched the latest in its series of ultraDirect laser direct imaging (LDI) dry film photoresists ultraDirect 700 offers fast photospeed and improved resolution over competitive LDI resists
This article was originally published on Electronicstalk on 15 May 2001 at 8.00am (UK)
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In trials, PWB designs with track spacing down to 32 microns have been realised using the new universal resist.
Exceptionally versatile, this universal dry film resist is suitable for use in both acid and alkaline print and etch processes, and outer layer pattern plate applications.
This eliminates the need to stock different resists and minimises the requirement to alter equipment settings.
The new resist is also compatible with Shipley's conventional dry films, making it easy for manufacturers to integrate LDI into their existing production processes.
This move by Shipley is another major step forward for the increasing numbers of manufacturers already using or considering LDI techniques for imaging very fine line PWB designs.
Working closely with leading fabricators and equipment manufacturers, Shipley is a key contributor to the development of the technology, which has the potential to facilitate significant increases in yield.
As LDI continues to gain market share, especially for prototype and low volume runs, ultraDirect demonstrates Shipley's commitment to helping its customers meet their imaging demands.
With an exposure energy of 9-15mJ/cm2 ultraDirect 700 is not only faster than previous generation products, but also has a significantly wider process window.
Good yellow light stability ensures further process flexibility.
PWBs can be held post-lamination with ultraDirect 700 for up to five days.
This unique versatility minimises rework and scrap in the event of disrupted working schedules or equipment failure.
Similar to previous releases in the ultraDirect series, the new resist develops very cleanly, has good adhesion to copper, good lamination characteristics and produces a well-defined phototropic image ideal for visual inspection.
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