Horizontal electroless copper process aids 3D PCBs

Edited by the Electronicstalk editorial team May 15, 2001

Shipley's Circuposit 4000 is the latest in a series of high performance, self-accelerating electroless copper technologies for horizontal metallisation of PCBs.

Shipley's Circuposit 4000 is the latest in a series of high performance, self-accelerating electroless copper technologies for horizontal metallisation of PCBs.

Designed for superior performance in small holes, Circuposit 4000 features good surface distribution and high throwing power for efficient production of the most complex multilayer boards.

The process efficiency benefits of horizontal processing - including better handling of thin layers, reduced cycle times and more flexible product scheduling - are widely understood.

Combined with Shipley's period pulse rectification (PPR) electrolytic copper system, and a choice of equipment from leading suppliers, Circuposit 4000 offers manufacturers a fully integrated, high-performance horizontal solution.

The new process is ideal for production of complex three-dimensional structures including blind, micro, buried and double-sided vias, as well as very fine tracks.

It offers good adhesion to advanced dielectrics used in sequential build up (SBU) manufacturing and is suitable for high aspect ratio through-hole plating.

Shipley has worked closely with a leading university research team and global equipment manufacturers to optimise the fluid delivery dynamics of the electroless copper system using advanced pressure field computer modelling techniques.

The result is the excellent surface distribution and high throwing power, which can be achieved with Circuposit 4000.

Process efficiency is further improved by the use of insoluble anodes in the Circuposit 4000 process.

The system also demonstrates high tolerance to multiple thermal shocks and advanced thermal cycling regimes.