Product category:
Communications ICs (Wireless)
News Release from: SiGe Semiconductor
Edited by the Electronicstalk Editorial
Team on 21 September 2001
SiGe goes to ASAT for Bluetooth
packaging
ASAT Holdings is to supply advanced package technology for SiGe Semiconductor's PA2423L Class 1 Bluetooth power amplifier.
ASAT Holdings is to supply advanced package technology for SiGe Semiconductor's PA2423L Class 1 Bluetooth power amplifier ASAT's Moisture Sensitive Level One (MSL-1) LPCC package eases manufacturing and delivers benefits in form factor and performance to high-speed wireless and portable applications
This article was originally published on Electronicstalk on 22 Jul 2008 at 8.00am (UK)
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ASAT's LPCC package enables SiGe to achieve a form factor of only 3 x 1.6mm, making the PA2423L the industry's smallest fully encapsulated Class 1 Bluetooth power amplifier.
The device also achieves MSL-1, eliminating the need for dry storage or baking of the package after exposure to air.
This eases manufacturing and reduces costs typically associated with storing and handling devices that use alternative package options.
"ASAT has been a significant contributor in our strategy to miniaturise Bluetooth RF components, and we are happy to announce them among our packaging partners", said Jim Derbyshire, president and CEO, SiGe Semiconductor.
"Using ASAT's advanced LPCC, the PA2423L has been an extremely successful addition to our portfolio, meeting customer demands for miniaturisation, performance and ease of manufacturing".
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