Product category:
Communications ICs (Wireless)
News Release from: SiGe Semiconductor | Subject: RF front-end modules
Edited by the Electronicstalk Editorial
Team on 28 January 2004
Front-end modules to simplify RF design
SiGe Semiconductor is to expand its product line with the industry's broadest range of chip-scale RF front-end modules for multimode, dual-band Wi-Fi systems and cellular handsets.
SiGe Semiconductor is to expand its product line with the industry's broadest range of chip-scale RF front-end modules for multimode, dual-band Wi-Fi systems, and cellular handsets compliant to the GSM, CDMA, cdma2000, GPRS and Edge standards Scheduled to begin rolling out in early 2004, the new cost-effective, silicon-efficient modules will include the world's smallest GSM RF front end, and the industry's highest performance module for dual-band, multimode 802.11a/b/g WLAN systems
This article was originally published on Electronicstalk on 23 Jan 2008 at 8.00am (UK)
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Complete 802.11a/b/g/n WLAN RF front-end modules provide all the functionality required between the transceiver and the antenna in dual-band Wi-Fi systems.
Wi-Fi modules target wireless niches
Three new RF front-end modules allow manufacturers to optimise the performance, battery life and transmission range required of a full complement of emerging Wi-Fi applications.
The roadmap also includes chip-scale solutions for 802.11b/g WLAN systems, quad-band CDMA handsets, and dual-mode GSM/WCDMA and GSM/cdma2000 handsets.
The front-end modules will integrate all of the RF circuitry required between the transceiver and the antenna, including the power amplifiers, power detectors, filters, switches, matching and bias components.
SiGe's strategy addresses the growing market for power amplifier modules, which is expanding as a result of the significant advantages modules bring to equipment manufacturers.
Further reading
RF front ends bring Wi-Fi to handsets
SiGe Semiconductor has developed the industry's first completely integrated WLAN RF front-end modules optimised for cellular handsets.
Next-generation GPS in one chip
Receiver greatly simplifies dual-antenna system design because it integrates antenna sensing, switching and a high-performance low-noise amplifier.
A single chip-scale module can replace up to 70 components in a typical wireless front-end.
The plug-and-play capability simplifies design, reduces bill of materials for lower cost and board area, and speeds time to market.
This allows manufacturers to easily meet the shorter time-to-market windows for emerging 2.5G and 3G cellular handsets, and portable Wi-Fi devices.
"With our new modules, we expect to capture a significant share of these markets", said Alistair Manley, Senior Director of Marketing for SiGe Semiconductor.
"The initial feedback from customers sampling our WLAN, CDMA and GSM modules is that we have surpassed the competition in terms if integration, performance and power efficiency.
We have achieved this by using the best process technology for each function to optimise performance and reliability".
As part of this strategy, SiGe Semiconductor has applied its expertise in analogue and mixed-signal design and process technology to develop GaAs-based switches.
In addition to being integrated with the company's industry-leading SiGe-based PAs into chip-scale modules, these switches will be available for purchase as companion parts to SiGe's stand-alone power amplifiers.
SiGe's strategy follows from the success of its RangeCharger Bluetooth and 802.11b/g WLAN power amplifiers, recognised for their ability to enhance data throughput and transmission range.
To date, more than five million RangeCharger PAs have shipped worldwide, integrated into cordless telephones, laptop computers, PDAs, PC cards, access points and computer peripherals that are on the market today.
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