Product category:
Communications ICs (Wireless)
News Release from: SiGe Semiconductor | Subject: SE2545A10
Edited by the Electronicstalk Editorial
Team on 07 February 2006
RF module brings wireless standards
together
A new module is billed as the world's first complete RF front-end for Wi-Fi products designed to comply with the IEEE802.11n draft specification.
SiGe Semiconductor has developed the world's first complete RF front-end module for Wi-Fi products designed to comply with the IEEE802.11n draft specification The SE2545A10, which integrates two full dual-band transmit/receive chains, provides manufacturers with a fully tested solution that simplifies design, and features the integration and efficiency required to support wireless multimedia services without compromising battery life, size or performance
This article was originally published on Electronicstalk on 24 Jun 2008 at 8.00am (UK)
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This announcement comes on the heels of the significant activity by industry leaders developing draft 802.11n products.
The IEEE802.11n specification will enhance the range and throughput of Wi-Fi, while maintaining backwards compatibility to the enormous worldwide installed base of WLAN infrastructure.
The higher throughput of 802.11n will allow WLAN products to diversify away from standard "data" centric applications and move to other large consumer markets such as high definition video and media distribution.
Further reading
WLAN front ends shrink for portable appeal
Complete 802.11a/b/g/n WLAN RF front-end modules provide all the functionality required between the transceiver and the antenna in dual-band Wi-Fi systems.
Power amplifiers cut Wi-Fi costs
SiGe Semiconductor has released two new power amplifiers that provide manufacturers with the lowest cost route to developing Wi-Fi systems.
RF front-end module optimises Wi-Fi systems
The SE2593A delivers a complete 2.4 and 5GHz WLAN multiple input, multiple output (MIMO) RF solution including all of the circuitry required between the transceiver and the antennas
"802.11n will open markets that could double existing WLAN penetration", said Andrew Parolin, Director of Wireless Data Products at SiGe Semiconductor "We have been actively following the standard, and are collaborating with other industry leaders to design for interoperability as the first 802.11n products come to market".
"Our new module is sampling to lead customers, and initial feedback is that we have effectively solved all of the RF challenges associated with MIMO design".
The SE2545A10 is the first RF front-end module to integrate two full dual-band transmit/receive chains (two 2.4GHz transmitters, two 5GHz transmitters, two 2.4GHz receivers and two 5GHz receivers) required for multiple input, multiple output (MIMO) operation.
The front-end module replaces up to 60 components, providing all of the circuitry required between the transceiver and the antenna in a single, chip-scale package.
The complete, fully tested device simplifies test and manufacture compared with alternative approaches, which include discrete transmit/receive designs, or separate modules for each chain.
These approaches also require larger board area, making it difficult to meet the shrinking form factors of new consumer electronics.
When designing dual-band MIMO solutions, manufacturers face several challenges.
The integration of multiple receive and transmit chains increases RF complexity, making it difficult to meet desired yields during test and manufacture.
The SE2545A10 is based on a proven, highly integrated architecture that is designed specifically to eliminate this challenge.
The device includes two dual-band transmit/receive chains, including the power amplifiers, power detectors, switches, diplexers and associated matching.
The RF ports are fully matched to 50ohm, which simplifies PCB layout and the interface to the transceiver.
The module is fully tested for ease of design and optimal yields.
The SE2545A10 is capable of +18dBm output power in 802.11b mode, +17dBm output power in 802.11g mode, and +15dBm output power in 802.11a mode.
The device meets all ACPR requirements in 802.11b mode, and operates with an error vector magnitude of less than 3% while in 802.11g or 802.11a modes.
The SE2545A10 also features a power detector for each band with 20dB of dynamic range for each transmit chain.
The combination of the power detector and optimised internal matching results in performance that is 1-2dB better than discrete solutions.
The SE2545A10 offers high efficiency at the required output powers to maximise battery life in portable consumer electronics.
Operating in 802.11g mode, the SE2545A10 consumes just 135mA at 17dBm.
The device is equipped with power control features including separate digital enable control for each transmit chain.
The SE2545A10 is supplied in a lead-free chip-scale package measuring 10 x 14 x 1.1mm.
This is roughly the size of most 802.11g solutions, and about 70% smaller than discrete implementations.
The small size allows manufacturers to integrate the additional RF chains required of enhanced wireless products while accommodating shrinking form factors.
The SE2545A10 is sampling now.
A higher power variant of the SE2545A10 will be available later this year for access points and PCs.
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