Product category:
Discrete Power Devices
News Release from: International Rectifier | Subject: FlipKY
Edited by the Electronicstalk Editorial
Team on 23 September 2003
Schottky shrinks into BGA packaging
The FlipKY is billed as the smallest Schottky diode in the industry.
The FlipKY is billed as the smallest Schottky diode in the industry The IR140CSP FlipKY device uses standard ball-grid array (BGA) technology, and occupies a total area of 2.25mm2 - or 86% smaller than the standard SMA package, and as much as 32% smaller than similar competing leadless devices
This article was originally published on Electronicstalk on 21 Oct 2005 at 8.00am (UK)
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The 1A, 40V Schottky diode is a four-ball, 1.5 x 1.5mm device with a profile of less than 0.8mm.
The FlipKY revolutionises the low power Schottky diode market by eliminating the lead frame and epoxy traditionally used in other devices.
The FlipKY is ideal for handheld, portable equipment such as cellphones, PDAs, notebook computers, handheld computers, MP3 players and hard disk drives where the small size is crucial to equipment success.
BGA technology enables size reduction and better heat transfer away from the die junction to the circuit board.
Moreover, as this device is made with true chip scale packaging, it dissipates heat directly from the die into the air, increasing thermal efficiency.
In fact, thermal resistance junction-to-ambient is rated at 750C/W maximum and thermal resistance junction-to-PCB is typically 550C/W.
As the IR140CSP is so small, it allows strategic placement on the circuit board, drastically reducing stray inductance and increasing overall circuit efficiency.
The FlipKY device is leadless, and minimises lead inductance compared to all lead frame and axial packages.
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