Product category:
Power Supply ICs and Controllers
News Release from: International Rectifier | Subject: IR11867-E02 and IR11867-E01
Edited by the Electronicstalk Editorial
Team on 24 November 2004
Automotive modules come in new power
packages
A new power packaging technology aims to solve design challenges found in electrohydraulic/electric power steering and automotive motion control applications.
International Rectifier has introduced an innovative, new power packaging technology to solve design challenges found in electrohydraulic power steering (EHPS), electric power steering (EPS) and automotive motion control applications This new die-on-leadframe (DOL) packaging sets new standards in thermal and electrical performance while reducing size and weight, delivering a viable path to automakers looking to migrate to more sophisticated systems like the transition from hydraulic steering systems to EHPS and full electric systems
This article was originally published on Electronicstalk on 15 Feb 2001 at 8.00am (UK)
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For example, EPS is an enabling technology for four-wheel steering systems and improved vehicle stability control (VSC).
However, limitations in electrical efficiency, the availability of current on the vehicle bus, and torque ripple which adversely affects "steering feel", have delayed the proliferation into higher-kerb-weight vehicles.
IR's new patent-pending DOL concept in power inverter packaging delivers the lowest package inductance and resistance by minimising the number of material layers to improve thermal performance while reducing the number of interconnections.
Further reading
MOSFETs improve power density on both sides
New from International Rectifier are two TO-220-packaged HEXFET power MOSFETs that maximise power density and performance in primary- and secondary-side DC/DC convertor circuits.
Rad-hard MOSFETs protect and survive
With high radiation hardness and unparalleled single event effect (SEE) immunity, International Rectifier's new R5 MOSFETs are well suited for systems that must survive penetrating gamma rays.
Lower thermal resistance allows the use of smaller silicon devices.
The significantly lower inverter electrical resistance allows for higher current capabilities with smaller die sizes and lower torque ripple.
For medium- to high-power applications, DOL packaging offers better electrical conductivity and increased thermal performance than alternative packaging methods using insulated metal substrate (IMS), direct-bonded copper (DBC) to a ceramic substrate, thick film substrates or PCB-based modules, which primarily use discrete power devices.
A DOL power module includes silicon devices directly soldered to a copper leadframe within an injection-molded shell.
The internal components are connected directly to outside terminals, eliminating intermediate insulation and conductive layers.
The first IR devices to use DOL technology are IR's automotive power modules for EPS and EHPS applications.
The IR11867-E02 is a 120A module, and the IR11867-E01 is a 160A module.
The current ratings are continuous capability at maximum junction temperature of 175C and include built-in temperature-sense feedback and bus-current sensing.
Other features include high frequency, low inductance package for electromagnetic compatibility (EMC) and an integrated decoupling capacitor across negative and positive bus for EMI suppression at high frequencies.
The DOL modules are housed in a compact plastic package, 60 x 36 x 8mm.
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