MOSFET chipset cuts component count in half

A new synchronous buck convertor chipset is suitable for high-frequency high-current DC/DC convertors used in advanced telecomms and datacomms systems.

International Rectifier has introduced a new DirectFET MOSFET synchronous buck convertor chipset which is suitable for high frequency, high current DC/DC convertors used in advanced telecomms and datacomms systems and next generation Intel and AMD processors found in high-end desktops and servers.

For example, in 130A five-phase convertors, the IRF6619 and IRF6633 chipset delivers 85% efficiency in a compact footprint.

The new IRF6619 and IRF6633 chipset replaces four standard D-Pak MOSFETs per phase in processor power systems, cutting component count in half and reducing MOSFET board space by over 50% per phase, enabling a smaller form factor for workstations and servers.

An ideal synchronous MOSFET, the IRF6619 features a very low typical device on-resistance of 1.65mohm at 10V GS and 2.2mohm at 4.5V GS, with a low reverse recovery charge of 22nC.

The IRF6619 is housed in the MX medium can DirectFET package, occupying the same board area as an SO-8, but with a 0.7mm profile.

The IRF6633 is best-suited as a control FET, with very low gate charge and Miller charge of only 4nC, and has more than 43% reduction in on-resistance times gate charge compared with other 20VN devices on the market.

The IRF6633 performance figure-of-merit for combined on-state resistance and gate charge is 38mohm-nC.

The IRF6633 is housed in the MP medium can DirectFET package, occupying the same board area as SO-8 with only 0.7mm profile.

International Rectifier's patented DirectFET MOSFET packages present a whole new set of design advantages not previously delivered by standard plastic discrete packages.

Their metal can construction enables dual-side cooling that effectively doubles the current handling capacity of high frequency DC/DC buck convertors powering advanced microprocessors.

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