Product category:
Discrete Power Devices
News Release from: International Rectifier | Subject: FlipKY Schottky diodes
Edited by the Electronicstalk Editorial
Team on 21 October 2005
Schottky diodes are smaller and more
efficient
Four new FlipKY Schottky diodes are smaller and more efficient than typical industry-standard Schottky devices.
International Rectifier has introduced four new FlipKY Schottky diodes that are smaller and more efficient than typical industry-standard Schottky devices Offered in space-saving chip-scale packages (CSP), these new 0.5 and 1.0A devices are ideal for handheld, portable equipment where space is crucial such as cellphones, smart phones, MP3 players, PDAs and miniature hard disk drives
This article was originally published on Electronicstalk on 15 Feb 2001 at 8.00am (UK)
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The 30V IR0530CSP and 40V IR05H40CSP are 0.5A devices housed in a compact three-bump, CSP that occupies only 1.1mm2 of board space with a profile of less than 0.6mm.
Compared with industry-standard SOD-123-packaged Schottky diodes, IR's new 0.5A FlipKY devices occupy 80% less board space and operate up to 40% cooler.
The 30V IR130CSP and 40V IR1H40CSP are 1A BGA devices, occupying only 2.3mm2 of board space, or about one third of the area consumed by a JEDEC DO-216AA package, yet deliver similar electrical and thermal performance.
These new devices are available as lead-free and tape and reel versions.
IR's FlipKY chip-scale packaging technology eliminates the lead frame, epoxy and mould compound traditionally used in other device packages and provides all electrical connections on one side of the silicon.
This design not only minimises board space and device profile, but also reduces parasitic inductance.
In high frequency switching applications, such as boost convertors for LCD displays or LED drives, less parasitic inductance reduces voltage spikes and switching noise, which improves electrical efficiency and reduces EMI.
The large bumps of the new 0.5A devices like the IR05H40CSP also serve as very efficient heat conduction paths to the PCB, enabling cooler operation than traditional leadframe devices.
In addition, the packaging technology enables the parts to be assembled with standard SMT techniques.
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