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Product category: Power Supply ICs and Controllers
News Release from: International Rectifier | Subject: IR38xx SupIRBuck family
Edited by the Electronicstalk Editorial Team on 30 November 2007

PoL regulators enable cut and paste
power design

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Wide-input single-output synchronous buck voltage regulators target high-density high-performance data centre and consumer applications.

New from International Rectifier, the SupIRBuck family of wide-input single-output synchronous buck voltage regulators target high-density high-performance data centre and consumer applications The IR38xx SupIRBuck family of point-of-load (POL) voltage regulators integrates IR's benchmark HEXFET trench technology MOSFETs and a high performance synchronous buck control IC in a compact 5 x 6mm power QFN package, shrinking the silicon footprint by 70% compared with discrete solutions, and offering between 8 to 10% higher full-load efficiency than competing monolithic ICs

"Because SupIRBuck has a unique, scalable common footprint, designers can simply 'cut and paste' their design to significantly reduce risk and enable faster time to market", says Tim Phillips, Vice President of IR's Enterprise Power Business Unit.

"The addition of the SupIRBuck POL family to IR's industry-leading XPhase and DirectFET multiphase architecture allows us to provide the most efficient and complete power solution for the data centre including enterprise servers", he adds.

Designed for 4, 7 and 12A of output load current at 600kHz switching frequency, the IR38xx operates from a wide input voltage range of between 2.5 to 21V, and provides output voltage as low as 0.6V.

Common features include prebias startup, fixed 600kHz switching frequency, hiccup current limit, thermal shutdown, and precise output voltage regulation.

Optional features include tracking, programmable power good, and 300kHz switching frequency to provide an additional 2A of output current capability.

The SupIRBuck family's thermally enhanced package with slim 0.9mm profile, allows mounting on the backside of the motherboard, making the devices ideally suited for space constrained, high-density server applications.

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