Chipset boosts memory bandwidth
Silicon Integrated Systems, Samsung Electronics and Rambus have codeveloped the SiS R659 next-generation RDRAM-based chipset for performance computing and multimedia gaming markets.
Silicon Integrated Systems (SiS), Samsung Electronics and Rambus have codeveloped the SiS R659 next-generation RDRAM-based chipset for performance computing and multimedia gaming markets.
"SiS is pleased to partner with Samsung and Rambus to develop leading-edge chipsets with RDRAM technology", said Stephen Chen, Senior VP at SiS, a leading provider of core logic and graphics chips.
"SiS is committed to delivering the highest performance products at great value to our customers".
The R659 chipset is the second offering from SiS' family of RDRAM products.
Incorporating high-speed interface and memory controller technology from Rambus, the R659 chipset drives four channels of 1200MHz RDRAM resulting in 9.6Gbyte/s of memory bandwidth - 50% higher than from competing dual-channel DDR chipsets.
The chipset also includes architectural enhancements for higher performance through faster response time, as well as up to 16Gbyte of total memory capacity.
"This joint development effort combines advanced core logic design with superior memory expertise and manufacturing excellence", said Tae Sung Jung, Vice President of Memory Product Planning and Engineering, Samsung, the industry-leading memory technology supplier.
"The four-channel RDRAM architecture is a straightforward and elegant solution to increase memory bandwidth, providing customers with an easy transition path to higher performance computing".
The next generation RDRAM chipset achieves unmatched performance using standard commodity RIMM modules available today and already supported by the industry.
This latest Rambus solution from SiS pairs the SiSR659 with the SiS964 in the south bridge, which integrates USB 2.0 with up to eight ports and Serial ATA features.
"Performance is the foundation of today's PC market.
Asus is always interested in the highest bandwidth chipset platforms to pair with today's fastest processors", said Jerry Shen, Senior Vice President at Asustek.
"We applaud SiS and Samsung's dedication to providing innovative solutions to motherboard manufacturers".
Sample delivery of the SiS R659 is scheduled for the third quarter of 2003.
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