Camera chips leverage novel 3D-SiP techniques

Sharp has become the first manufacturer in the industry to develop a 0.5mm ball pitch technology for 3D systems-in-package (3D-SiPs).

Sharp has become the first manufacturer in the industry to develop a 0.5mm ball pitch technology for 3D systems-in-package (3D-SiPs).

One thing that has been very difficult to implement with conventional SiP technologies is now possible thanks to this innovation: the stacking of DSP, Flash memory and SDRAM in one stack with 14 x 14mm edge length and 1.7mm in height.

The bottom module contains the DSP on one substrate of only 0.25mm in height and fits perfectly into the gap created by the 0.5mm ball pitch.

The second module, which integrates a 32Mbit Flash memory and one or two 256Mbit SDRAMs, is placed on top of it.

This means that logic and memory ICs only need 58% of the mounting surface, compared with the normal approach of placing the DSP and the memory (Flash and SDRAM) in two separate housing stacks.

The first two products to use the new technology are the LR38683 and the LR38682 LSI systems specifically designed for digital cameras in the 3-10Mpixel range.

But manufacturers of mobile devices such as mobile phones and PDAs will also benefit from the new 3D-SiP technology because it facilitates the design-in of high performance LSI systems with the same space needs.

Another advantage of the 3D-SiP technology is its far-reaching flexibility.

Depending on the specific requirements of the application, the various modules (memory units or highly functional multipin circuits such as logic ICs) can be combined in different configurations.

Therefore, for digital cameras, the memory function can vary in accordance to the resolution of the CCD camera module.

Samples of the two LSI systems, the LR38683 and the LR38682, are available immediately worldwide from Sharp sales outlets and distribution partners.

Serial production is scheduled to start in July 2005.

Back to top