IGBT modules handle more heat on the road

Solder-free IGBT module has five times higher temperature-cycling capability for convertors in electric and hybrid vehicles.

Semikron has developed a 100% solder-free IGBT module for 22-150kW convertors in electric and hybrid vehicles.

The SKiM has a five times higher temperature-cycling capability than modules that use a baseplate and soldered terminals.

Although some power semiconductor manufacturers are still working on soldered contacts to meet the high temperature requirements of the automotive industry, solder-free pressure contact technology and sintered chips offer the optimal solution to increase the temperature cycling capability.

The new module's high temperature capabilities include a maximum junction temperature of 175C and operation at ambient temperatures up to 135C, allowing one dedicated coolant loop to be omitted.

The solder-free pressure system and an internal laminated busbar provide a homogeneous current distribution.

Every IGBT and diode chip has its own connection to the main terminal.

The result is a low module resistance of 0.3mohm maximum, compared with a value of approximately 1.1mohm from a soldered module.

The connection to the driver board is also solder-free with springs for high temperature cycling and fast solder-free mounting.

The chips are not soldered but sintered to achieve the high power-cycling capability.

The sinter joint is a thin silver layer that has a superior thermal resistance to a soldered joint and, due to the high melting point of silver, no joining fatigue, which leads to an increased service life.

As there is no baseplate, the connection of the direct-copper-bonded (DCB) substrate to the heatsink can "move" without limiting the temperature-cycling reliability.

SKiM withstands severe automotive environments, being highly resistant to shock and vibration stress.

The packaging and connection technology of the SKiM module fully exploits the capabilities of the silicon, resulting in a cost-efficient solution.

More than 15 years of experience in pressure contact technology is integrated into the SKiM IGBT module.

Fast design-in is guaranteed by the standard terminal height of 17mm and a configuration similar to other six-pack modules.

Two case sizes are available: SKiM 63 (120 x 160mm) and SKiM 93 (150 x 160mm).

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