Semikron IGBT module utilise Fuji V-IGBT chips
Semikron has introduced a low-inductance 1,200V Semitrans IGBT module series for use in AC/DC converters in the 20-300kW power range.
These modules are available with Fuji fifth-generation V-IGBT chips as am alternative to IGBT4 chips.
The low 15nH module inductance is said to offer two advantages: 50V higher DC link voltage thanks to the lower switching over-voltages; plus faster and softer IGBT switching, producing lower switching losses and boosting overall efficiency.
In addition to the existing Semitrans modules with IGBT chips from Infineon, Semitrans modules are also available with V-IGBTs from Fuji, offering a blocking voltage of 1.200V.
The V-IGBT-based modules are available in three different sizes, eight different power classes and three switching topologies, with rated currents of 150A to 600A.
Semitrans 3 and 4 modules feature low inductance, with a module inductance of 15nH.
The typical IGBT switching speed of 5000A/us results in a module overvoltage of 75V.
The modules come in single-switch, half-bridge or chopper topology for inverters in industrial drives or any other application area.
Standard Semitrans modules feature high insulation strength of 4,000V/min, which is 60 per cent higher than the global insulation strength norm of 2,500V/min.
In addition to the 1200V modules featuring IGBT2, IGBT2 fast, IGBT3 or IGBT4 technology, the modules are also available with blocking voltages of 600V and 1,700V.
Three standard Semitrans case outlines are available: 34mm-wide Semitrans 2 and 62mm-wide Semitrans 3 and 4 modules.
Additional sizes are also offered for non-standard customer applications.
Examples include Semitrans 6 with six-pulse inverter bridge circuits, and Semitrans 5 with circuits for three-level inverters as well as for current monitoring, which is achieved by integrating shunts into the modules.
Semitrans 9 has been developed to provide insulation strength of 9kV for railway applications.
All Semitrans modules feature a copper baseplate.
Not what you're looking for? Search the site.
Tel (Germany) +49-911-6559-158
-
SKiiP4 power module launched by Semikron
Semikron has introduced SKiiP4, a range of intelligent IGBT power modules that offers a longer service life than non-sintered modules and can be used in higher-temperature applications. -
IGBT power modules offer extended service life
Skiip4, the latest IGBT intelligent power module (IPM) from Semikron, is designed to offer a longer service life than non-sintered modules and can be used in higher temperature applications. -
Semikron reveals burn-in tests for Skiip IPMs
Semikron's range of accelerated burn-in tests for its Skiip intelligent power modules (IPMs) are intended to ensure high levels of reliability in inverter applications in wind power and other systems. -
IGBT driver helps boost system reliability
The Skyper 52 uses differential signal processing to provide a high level of signal integrity and high noise rejection -
Power module allows solder-free assembly
Power, control and auxiliary contacts are connected directly to the printed circuit board via springs, not solder joints.
Browse by category
- Active Components (11658)
- Analogue and Mixed-Signal ICs (1740)
- Communications ICs (Wired) (1803)
- Discrete Power Devices (433)
- Programmable Logic Devices (608)
- Microprocessors, Microcontrollers and DSPs (2090)
- Memory Devices and Modules (773)
- Power-Supply ICs and Controllers (2460)
- Communications ICs (Wireless) (1605)
- Standard Logic Devices (142)
- Passive Components (3265)
- Design and Development (9685)
- Enclosures and Panel Products (3522)
- Interconnection (3228)
- Electronics Manufacturing, Packaging (3257)
- Industry News (1982)
- Optoelectronics (1790)
- Power Supplies (2618)
- Subassemblies (5097)
- Test and Measurement (5332)
