Investment boosts SMT placement and rework

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

With increasing demand for fine pitch placements alongside a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

The new system has dual benefits of being able to place fine pitch devices in low volume as well as being able to rework advanced packages such as BGA and mBGA.

The placement/rework system has been beneficial in assisting with prototypes, hand build and hand placement of BGA devices.

The system is also invaluable allowing us to remove components to perform solderability checks.

The SMT/BGA placement/rework equipment has been specially designed to cope with the challenges of repairing today's PCB assemblies.

This will enable Speedboard to provide extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including BGAs.

In addition, the rework system comes with a good range of standard features including CCTV vision system with split beam prism, precision pickup system, macro-micro x/y/theta PCB table, advanced focused infra-red heating, lens attachments with images up to 70 diameter, 500W IR back heater system and precision PC and assisted digital electronic control.

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