Approval for 184-pin FBGA-based DDR DIMMs

Prototype 184-pin PC2700 registered FBGA-based DDR DIMMs from SMART Modular Technologies have been successfully tested and conform to the new JEDEC DDR333 standard.

Prototype 184-pin PC2700 registered FBGA-based DDR DIMMs from SMART Modular Technologies have been successfully tested and conform to the new JEDEC DDR333 standard.

Nanya Technology Corporation contributed to this effort to launch the next generation of DDR technology by providing DDR333 devices for the initial prototype builds.

The devices used on the PC2700 DIMMs are packaged in the industry-standard FBGA (fine-pitch ball grid array) footprint.

This standard is the first SDRAM to use the FBGA footprint, which requires more advanced manufacturing techniques, versus the traditional TSOP footprint.

"These modules represent a snapshot of things to come", said Desi Rhoden, CEO of Advanced Memory International and Chairman of the Board for JEDEC.

"The PC2700 registered DIMM represents the first major transition from TSOP to BGA memory devices in JEDEC-standard memory modules.

SMART and Nanya enabled early customer shipments via their continued co-operation in developing new memory technologies".

JEDEC completed the DDR333 memory device standard in May 2001.

Deployment is currently underway for 184-pin PC2700 registered DDR DIMMs, and initial prototype evaluations are in process within the JEDEC working group.

"Nanya enabled early build of registered DDR333 DIMMs by providing devices packaged in the industry-standard 60-ball BGA footprint to SMART for DIMM assembly.

These early DIMMs are being evaluated by IBM Microelectronics as part of our efforts to support the JEDEC JC-42.5 module standards group", noted Mark Kellogg, IBM's JEDEC representative.

"Nanya continues its leadership role in DDR technology and manufacturing by beginning volume production of DDR333 devices in both 128 and 256Mbit densities", stated Ken Hurley, President of Nanya Technology Corp.

USA.

"In order to support industry requirements, Nanya will offer both TSOPII and BGA packaging options".

"SMART's ongoing intent is to accelerate the introduction of new memory technologies", stated Mike Rubino, Vice President of Engineering.

"Our support of the initial PC2700 prototype builds represents our commitment to helping to enable new industry standards".

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