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News Release from: Soldertec Global
Edited by the Electronicstalk Editorial
Team on 19 January 2007
Conference covers lead free components
reliability
IPC has joined forces with Soldertec Global to provide viable solutions to lead free quandaries by hosting an International Conference on Lead Free Components Reliability.
More than six months since the implementation of the RoHS Directive, many electronics manufacturing companies still find themselves in an environment of evolving questions, implementation concerns and elusive issues around lead-free soldering production Poor wetting, heat resistance, lead free contamination and reliability are unending challenges with no clear answers in sight
This article was originally published on Electronicstalk on 4 Mar 2005 at 8.00am (UK)
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IPC has joined forces with Soldertec Global to provide viable solutions to lead free quandaries by hosting an International Conference on Lead Free Components Reliability, on 28th February 2007 in San Sebastian, Spain.
IPC and Soldertec Global have engauged a number of reliability experts such as Jean-Paul Clech and Dr Yoshiharu Kariya, who will present in-depth reviews of lead free solder joint reliability and fatigue characteristics of lead free solder alloys, respectively.
In addition, a number of European experts from the Elfnet (European Lead Free Soldering Network) project, including IMEC, Ericsson, IVF, EMPA and the Fraunhofer Institute will detail the latest European perspective.
As an added bonus, the conference will be held in conjunction with a dissemination event (by EU projects Elfnet, Greenrose and Leadout) that will unveil the results of more than 3 years of high-level research on lead free technologies.
The combination of the technical conference with the dissemination event will provide an invaluable opportunity to find solutions on key questions like poor wetting, solderability on different surface treatments, heat resistance of FR4 material, lead contamination and CAF.
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