Workshop on circuit board failure analysis

Soldertec Global and Bob Willis, of EPS, will be holding a one-day practical failure analysis workshop on Tuesday 28th March 2007.

Soldertec Global and Bob Willis, of EPS, will be holding a one-day practical failure analysis workshop on Tuesday 28th March 2007.

This will be held at the laboratories of Tin Technology in St Albans, Hertfordshire.

The workshop brings together the practical and sophisticated methods of determining the root cause of failures on printed boards, components, materials and solder joints and identifying the common reasons why failures occur.

The failure analysis workshop is unique as it outlines different techniques which need to be considered along with practical case studies.

These will be examined with extensive examples and corrective actions will be recommended.

By holding this event at the laboratories of Tin Technology delegates can witness different failure analysis techniques.

They can also experience firsthand the resolution of the cause of failure using a range of specialised techniques which are not always available in their own facilities.

"Different levels of failure analysis exist, from the very basic requiring virtually no equipment, to the use of a full failure analysis laboratory".

"Often simple analysis methods can point engineers in the right direction, but proving the root cause of failure often needs the electronic pathologist with all his investigation tools", comments Course Leader, Bob Willis.

"When conducting any failure analysis it is important the results prove the cause of the fault".

"The true reason for failure needs to be clear and proven with hard facts, not just opinions".

The workshop is designed for engineers, supervisor and quality-engineering staff who need to solve manufacturing and product failures.

The cost of the workshop session is GBP 150 + VAT and includes refreshments, workshop notes and training CD-ROM.

The workshop will take place from 9.30am to 4.30pm.

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