Audit service to test compliance with RoHS

Edited by the Electronicstalk editorial team May 7, 2007

A new RoHS Reliability assessment service combines the strengths of an expert UK consultant and an independent laboratory report to assist manufacturers to become compliant with the directive.

Soldertec Global is currently launching a new RoHS reliability assessment service, which combines the strengths of an expert UK consultant and an independent laboratory report.

The modular options of this service enable an electronics manufacturing company to select an assessment package, which closely targets its individual needs.

The on-site consultancy comprises of a capability audit which includes board procurement, review of assembly processes, inspection of solder joints and handling of warranty returns.

The testing begins by examining the structure of the solder joints using X-ray inspection and scanning electron microscope images, but can also be extended to investigate accelerated life testing and the effect of vibration, utilising a range of instruments and techniques available at the Soldertec Global laboratory.

"The RoHS Reliability Service allows manufacturing companies to support their RoHS process capabilities with a report from an independent laboratory and a full day consultancy service from one the industries best known soldering engineers, Bob Willis of EPS", comments Tom Perrett, Marketing Manager at Soldertec Global.

"The reassurance that comes from the report and the advice given enables companies to progress knowing that they are building their lead-free manufacturing developments on firm foundations".

This new service builds on an established working relationship between Soldertec Global and Bob Willis during which time they have jointly co-hosted a number of successful SMART Group events at the laboratories of Soldertec Global at St Albans.

Most recently, a one day 'Failure Analysis' workshop, was held in which practical methods for determining the root cause of failures on printed boards, components, materials and solder joints were identified.

The next workshop will be held on 6th June 2007 at the laboratories of Soldertec Global.

Soldertec Global will be exhibiting at Nepcon 2007 and can be found at Stand L48.