Product category:
Electronics Manufacturing Quality Assurance
News Release from: Soldertec Global | Subject: X-ray inspection service
Edited by the Electronicstalk Editorial
Team on 29 April 2008
PCB assemblies analysed while you wait
Fast-turnaround inspection service using the Dage XiDAT 7600 X-ray inspection system provides quality assurance data on BGA mounting and other production issues.
Soldertec Global is offering a new "while-you-wait" inspection service using the Dage XiDAT 7600 X-ray inspection system The service can also be offered with a guaranteed 24-hour turnaround for companies who prefer to ship the boards via courier
This article was originally published on Electronicstalk on 4 Mar 2005 at 8.00am (UK)
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The ability of X-rays to penetrate through entire assemblies enables solder joint inspection of hard-to-access areas, including underneath ball grid array (BGA) and flip-chip components.
Missing, open, malformed and bridged BGA interconnections and misaligned components can now all be detected quickly and easily.
The Dage XiDAT 7600 system is capable of submicron resolution (down to 600nm) at high magnifications.
The contrast levels achievable using the digital image acquisition system are more sensitive than traditional analogue systems.
This allows subtle features to be easily identified, which can be used to assess structures and processes, and diagnose problems.
Via alignment issues, metallisation shorts, plated-through-hole barrel cracking and other PCB problems can also be identified.
"The inspection of BGAs using an X-ray imaging system has just got faster and easier", comments Dr Wayne Lam, Laboratory Manager at Soldertec Global's St Albans based testing facilities.
"The introduction of this new service allows us to react immediately to a customer's problem and solve it in a very short timescale".
"X-ray inspection is most commonly associated with BGA inspection but also has a vital role to play in the investigations of voiding and wetting of solder joints".
"We also see the technique as an important tool in nondestructive testing, allowing us to see defects that would not easily be detected by other methods".
The Dage XiDAT 7600 X-ray inspection system can be seen in action in the Live Technologies Area at National Electronics Week, Earls Court, London from 17th to 19th June 2008.
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