Product category:
Memory Devices and Modules
News Release from: Solid State Supplies | Subject: CS-Stack
Edited by the Electronicstalk Editorial
Team on 18 January 2002
New package provides stacks of memory
CS-Stack is a novel technology from DPAC that allows mechanical stacking of chip-scale package memory devices using a fine-pitch ball grid array (FBGA) interface.
CS-Stack is a novel technology from DPAC that allows mechanical stacking of chip-scale package memory devices using a fine-pitch ball grid array (FBGA) interface The use of chip-scale packaging results in a significant reduction in the size of component packaging when compared with current thin small outline package (TSOP) style memory packages
This article was originally published on Electronicstalk on 6 Feb 2001 at 8.00am (UK)
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Standard memory components currently being used and products scheduled for introduction in 2002, such as DDR-333 DRAM will use this advanced packaging, and will be available from Solid State Supplies.
Traditional memory stacking methods will not work with this package style, and DPAC believes it is the first company to announce an electromechanical solution.
"DPAC has invested several years of research into this breakthrough", said Matthew Cook, DPAC Franchise Manager at Solid State Supplies.
"DPAC has always had a commitment to be first to market innovative high-density memory products, and CS-Stack is its latest".
CS-Stack is being launched as a competitive solution to consider for DR-333 stacking requirements.
CS-Stack is based on the time-tested principles used by DPAC in manufacturing millions of LP-Stacks.
Unlike other products that rely on proprietary memory module designs, CS-Stack is expected to be compatible with industry-standard proposals.
(This was Electronicstalk's Top Story on 17 January 2002).
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