Rectifiers shrink into novel packaging

Edited by the Electronicstalk editorial team Feb 24, 2004

A new series of 1A Schottky rectifiers feature all-new Ultramite low-profile surface mount packaging technology to cut component height in half, and the weight by a third.

Ultramite is a new low-profile surface mount packaging technology that simplifies handling and mounting, minimises parasitics and is available with either conventional termination plating or an environmentally friendly lead-free version.

The first devices to use the breakthrough concept from Microsemi Corp include a series of 1A Schottky rectifiers that cut component height in half, and the weight by a third.

Designated the UMA5817, UMA5818 and UMA5819, these new rectifiers are designed with footprints and electrical specifications that are identical to the conventional 20, 30 and 40V devices they replace.

The lead-free (Pb) versions are designated UMAF5817, UMAF5818 and UMAF5819.

"Packaging innovation to reduce size has always been a strong suit for Microsemi", said Phil Masters, Franchise Manager for the line.

"That this development also includes a version free of lead is particularly noteworthy, coming at a time when many in the industry are searching for ways to improve the environmental impact of their products".

Performance advantages include reduced parasitics and enhanced thermal characteristics provided by an exclusive assembly technique that eliminates lead frames and wire bonds, plus rugged integral terminations in lieu of J leads.

The new Ultramite rectifiers target applications using conventional SMAJ5817/18/19 (SS12/13/14) devices and are configured to fit the SMAJ (DO-214AC or DO214BA) footprint.