3G transceiver has all bands covered

A third-generation single-chip multistandard transceiver addresses 3G cellular applications worldwide across the 850MHz, 900MHz, 1.7GHz, 1.9GHz and 2GHz bands.

Sony Europe's Semiconductor and Electronic Solutions division has extended its range of transceiver ICs for 3G mobile communications applications with the introduction of a third-generation single-chip multistandard transceiver that addresses 3G cellular applications worldwide across the 850MHz, 900MHz, 1.7GHz, 1.9GHz and 2GHz bands.

The CXA3361AGG is designed for use both by manufacturers of 3G handsets and by manufacturers of 3G terminal platforms.

Its small (6mm square) footprint reduces board space, while the direct conversion architecture and integral matching circuits reduce the bill of materials, simplify the design process, and speed time-to-market.

The transceiver supports multiple bands worldwide - Europe, USA and Asia - including UMTS and W-CDMA Bands I, II, III, IV, V, VI, VIII and IX.

It is also fully adapted for HSDPA (Category 6).

Using Sony's SiGe BiCMOS technology, the transceiver integrates upconvertor and downconvertor mixers, RF gain control amplifiers, and a baseband PGA and LPF.

It has the benefit of internal matching to the external SAW filters in both transmit (Tx) and receive (Rx) chains, thus minimising the number of external components that are required.

An RF synthesiser circuit comprising VCO, inductors and varactors is also integrated onto the chip, along with an advanced LPF (root raised cosine filter) for Rx channel select.

26/19.2MHz clock operation is supported, and control is via two three-wire buses.

The Tx section features a direct modulation transmitter, integrated variable gain amplifiers (VGA) and has a minimum dynamic range of 80dB.

There is a separate HSDPA mode.

The Rx section combines a direct conversion receiver, integrated chanel filter and integrated DC offset compensation.

The CXA3361AGG operates from a 2.7 to 3V DC supply, and the receiver draws 30mA typical, while the transmitter consumes 70mA in normal mode and 85mA in HSDPA mode (at Band I operation).

A power reduction feature progressively lowers the operating current as the output power decreases.

The device is housed in a miniature 97-pin VFBGA ball-grid array package measuring 6 x 6 x 1mm, with a 0.5mm ball pitch.

The transceiver is both lead (Pb) free and halogen free.

Operating temperature range is -25 to +85C.

Test samples are now available.

Engineering samples will be available in the third quarter of 2006, with production due to commence in Q1 2007.

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