Product category:
Memory Devices and Modules
News Release from: Silicon Storage Technology | Subject: SST25VF512 and SST25VF020A
Edited by the Electronicstalk Editorial
Team on 11 August 2006
Serial Flash shrinks into slimline
packaging
Advanced Z-Scale package enables customers to develop a wide range of revolutionary products based on the industry's smallest and thinnest form factor serial Flash.
SST has announced an advanced Z-Scale package (XFBGA) solution that enables customers to develop a wide range of revolutionary products based on the industry's smallest and thinnest form factor serial Flash The new ultrathin Z-Scale package is available for the SST25VF family of serial Flash devices in densities ranging from 512Kbit to 4Mbit
This article was originally published on Electronicstalk on 27 May 2003 at 8.00am (UK)
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With a maximum total height of only 0.4mm and an area as small as 3mm2 (depending on memory density), SST's Z-Scale package is ideal for use in space- and height-constrained portable electronics, such as MP3 players, cellphones, camera modules and Bluetooth devices.
The new Z-Scale package is a true wafer-level package, using multilayer metal interconnect and routing techniques.
This level of interconnection redistributes the bonding pads of each chip evenly to external bumps that can be connected directly to the circuit board.
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This Z-Scale package is ideal for SST's "low-pin-count" SPI serial products for minimising required board real estate and maximising overhead clearance in aggressive physical designs.
The Z-Scale package is compatible with existing SMT (surface mount technology) infrastructures, requiring minimal investment on the part of manufacturers.
In addition, by using the same footprint for serial Flash devices ranging from 512Kbit through 4Mbit densities, the Z-Scale package provides an easy migration path for customers as their memory requirements change.
"Today's most popular consumer electronic devices, such as MP3 players, cellphones and digital cameras are moving towards smaller, thinner and lighter products", said Douglas Lee, Vice President of SST's Application Specific Memory Products group.
"The Z-Scale package strategy for our 25 Series serial Flash devices is perfectly in tune with the direction of the portable electronics market".
"Leveraging our new package solution, customers can achieve ultraportable designs that are impossible with standard sised serial Flash packages".
"In addition, the pin count reduction and significant board space savings enabled by the Z-Scale package provide designers more room to increase functionality in their products, which is especially critical in the fast-paced consumer electronics market".
SST offers this lead-free (non-Pb) Z-Scale package for its SST25VF family of serial Flash devices in densities ranging from 512Kbit to 4Mbit.
Samples of SST25VF512 (512Kbit) and SST25VF020A (2Mbit) serial Flash devices in this advanced Z-Scale package are available now.
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