Product category:
Memory Devices and Modules
News Release from: Spansion
Edited by the Electronicstalk Editorial
Team on 02 February 2007
Flash development centre moves to 300mm
wafers
Spansion's Submicron Development Centre has successfully completed its transition from 200 to 300mm wafers.
Spansion's Submicron Development Centre (SDC), the R and D headquarters for Spansion and the nucleus of the advanced manufacturing process for all Spansion Flash product lines, has successfully completed its transition from 200 to 300mm wafers Spansion is the only Silicon Valley company that has 300mm Flash memory in development and possesses the only 300mm R and D facility in California
This article was originally published on Electronicstalk on 4 Jun 2008 at 8.00am (UK)
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Spansion will transfer the 300mm process to its new SP1 300mm manufacturing facility as it comes on line in Japan.
There is approximately twice the area on a 300mm wafer than on 200mm - enabling more die per process run.
By late 2007 Spansion plans to be producing 65nm MirrorBit Flash memory devices at its new SP1 300mm wafer manufacturing facility in Aizu-Wakamatsu, Japan, followed by 45nm in production by mid 2008.
For the most advanced semiconductor equipment for geometries of 45nm and below, a 300mm wafer is required.
65nm technology can be produced on 200 or 300mm.
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