Product category:
Memory Devices and Modules
News Release from: Swissbit Group | Subject: Helios
Edited by the Electronicstalk Editorial
Team on 07 June 2004
Direct mounting creates low-profile ECC
SDRAMs
New from the Swissbit Group, the Helios is a low-profile ECC SDRAM module based on the latest chip-on-board technology.
New from the Swissbit Group, the Helios is a low-profile ECC SDRAM module based on the latest chip-on-board technology The SO-DIMM comprises 18 chips to provide a 16M x 8bit memory
This article was originally published on Electronicstalk on 7 Jun 2004 at 8.00am (UK)
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Low-profile SDRAM module takes a gigabyte onboard
Especially designed for notebook and industrial applications, the Mars SDRAM module features a memory capacity of 1Gbyte.
Despite the additional ECC chips, which build the checksum to recognise and correct memory errors during operation, the module features a low profile of less than 27mm.
The integration of ECC technology into a compact outline is a technological advantage Swissbit offers using its unique COB technology.
The memory chips, all produced by renowned suppliers, are directly stacked on the PCB.
This ensures optimal heat abstraction, improved circulation of air and excellent signal quality.
After production, the modules are fully tested with Advantest systems, and so they are suitable for industrial applications.
Furthermore the modules are offered for the use in extended temperature ranges.
The new 144-pin Helios ECC SO-DIMM is available with capacities of 128 and 256Mbyte in specifications from PC100 to PC333, runs from a 3.3V supply, and is compatible with the current JEDEC standard.
A refresh occurs every 64ms.
The new high performance memory module is deliverable now.
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