Product category:
Memory Devices and Modules
News Release from: Swissbit Group | Subject: COB memory modules
Edited by the Electronicstalk Editorial
Team on 15 April 2005
Chip-on-board modules suit embedded
applications
Swissbit reckons that its chip-on-board assembly method for memory modules offers many advantages not found in traditional surface-mount technology chip packaging forms.
Swissbit reckons that its chip-on-board (COB) assembly method for memory modules offers many advantages not found in traditional surface-mount technology (SMT) chip packaging forms, such as TSOP or BGA Depending on their configuration they are suitably designed for a wide variety of markets, ranging from consumer and upgrade products, in retail and VAR channels, to OEM applications in the embedded, industrial, telecommunications, networking, aerospace and military industries
This article was originally published on Electronicstalk on 7 Jun 2004 at 8.00am (UK)
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Now, a new classification of the COB module line has been added to address the entire range of applications while making it easier for Swissbit customers to identify the product they require.
Swissbit's COB modules are high quality products made in Germany.
The German Swissbit subsidiary incorporates a unique time tested manufacturing technology unlike any other in the world, which allows up to four times the quantity of chips to be mounted on the same surface area required by traditional SMT assembly.
This is achieved through the company's patented COB-die stacking technology.
Embedded and industrial applications represent a challenge to many module solutions due to the limited space on smaller profile system boards and the associated environmental requirements needed in terms of higher reliability, greater heat dissipation, ruggedisation and conformal coating.
COB technology provides the ideal solution to all these problems.
A module manufactured using COB technology has far better thermal properties than standard SMT modules, and can be offered in various operating temperature ranges.
What's more, COB uses a solderless bonding technology, thus doing justice to the conversion to "lead-free soldering" which all industrial applications will have to face in the near future.
Evaluation samples are available on request.
In order to meet the needs of various customers, provided is a simple product line overview that will address each market in relation to its requirements.
Swissbit has split its COB memory module portfolio into four class segments that are enhanced by the offering of some new products.
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