Product category:
Electronics Manufacturing Services
News Release from: ST Assembly Test Services | Subject: GaAs packaging services
Edited by the Electronicstalk Editorial
Team on 13 February 2001
STATS expands GaAs packaging capability
ST Assembly Test Services has expanded its gallium arsenide capability to support package assembly for integrated circuits on presawn wafers down to a market-leading 4mil thick.
ST Assembly Test Services has expanded its gallium arsenide capability to support package assembly for integrated circuits on presawn wafers down to a market-leading 4mil thick in an ongoing effort to maintain a leadership role in supporting the mixed signal communications market segment "The growing demand for high-speed, high-performance devices is the driving force for GaAs technology", says Lee Hoong Leong, Vice President of Leaded Operations
This article was originally published on Electronicstalk on 5 Feb 2001 at 8.00am (UK)
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"We are pleased to be able to support advanced technology solutions that keep our customers on the cutting edge".
This new assembly capability complements STATS' flexible business model, allowing customers to select the mix of GaAs capabilities that fit their device requirements.
Previously, STATS had positioned itself as a leader in GaAs handling by offering mechanical backgrinding and wafer saw services, mechanical backgrinding with full assembly, and assembly on thinned wafers to customers.
Recognising the unique handling challenges associated with supporting GaAs semiconductor material, STATS has refined the wafer handling procedures and processes on its state-of-the-art silicon manufacturing equipment to address this specialised technology.
As part of its ongoing commitment to safety, occupational health and care for the environment, STATS has built a comprehensive management programme for its GaAs assembly area that includes a separate sludge and waste water management system for backgrind and saw equipment.
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