Thermal simulation simplifies package design

ST Assembly Test Services (STATS) has extended its Simplified Package Modelling (SPM) services to customers in Europe and Asia.

ST Assembly Test Services (STATS) has extended its Simplified Package Modelling (SPM) services to customers in Europe and Asia.

SPM offers a unique approach to how thermal simulation is performed in the industry today.

Traditional thermal simulation methods analyse semiconductor devices based on final package design drawings and finite analysis calculations.

Rather than waiting for the completion of the final substrate or leadframe design, SPM can occur as soon as a customer identifies the basic package design requirements such as package type, die size, number of solder balls, and copper layers.

As demand for complex, nonsymmetrical, stacked die, and other multi-chip packages continues to grow, conventional simulation techniques are limited to a small symmetrical section of the package as opposed to the package being modelled in its entirety with SPM.

SPM also takes thermal simulation one step further by analysing not only the package itself, but also elements such as the underlying printed circuit board and heat sinks.

This translates into a distinct advantage for customers who have very large and/or complex package designs.

"The SPM methodology delivers unparalleled advantages to our customers through cycle time reduction, increased design flexibility, and a focus on complex design issues", said Dr Roger Emigh, Manager of Package Characterisation.

"Building on the success of SPM with customers in the USA, STATS is now extending its unique service offering to customers in Europe and Asia".

SPM provides customers with a new level of flexibility and capability through the combination of STATS' package design expertise, its extensive thermal test database, and Flomerics Flotherm simulation tool.

Customers receive SPM information at multiple points in the design process, which provides an opportunity to make necessary changes before final package design and reduces subsequent design changes or delays.

As a result, design cycle time can be dramatically decreased.

Since introducing the SPM approach last year in the USA, STATS' North American customers have enjoyed measurable benefits.

In addition to the ability to access accurate thermal resistance data without waiting for final design drawings, customers also receive unmatched design flexibility, design cycle time reduction, and full package simulation irrespective of complexity and package symmetry.

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