Product category:
Analogue and Mixed Signal ICs
News Release from: STMicroelectronics | Subject: EMIF06-SD02F3
Edited by the Electronicstalk Editorial
Team on 31 October 2007
Multifunction IC cleans up card
interfaces
Memory-card transceiver integrates signal conditioning, bidirectional level shifting, ESD protection, EMI filtering and a 2.9V voltage regulator.
STMicroelectronics has developed a tiny, highly integrated chip using its Integrated Passive and Active Devices technology that provides five essential functions required by memory card interfaces in mobile phones, GPS navigation devices, digital cameras and a broad range of other consumer and industrial products that use removable Secure Digital (SD) protocol cards The new flip-chip EMIF06-SD02F3 memory-card transceiver integrates signal conditioning, bidirectional level shifting, ESD (electrostatic discharge) protection, EMI (electromagnetic interference) filtering and a 2.9V voltage regulator
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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Integration of these circuits into a single monolithic chip increases system reliability and saves more than 75% of the board area required by a typical discrete solution.
The EMIF06-SD02F3 requires less than 7mm2 of board space, compared with approximately 30mm2 to provide the same functions with discrete components, also simplifying the design and layout of the application.
The chip is compliant with standard and high-speed SD standards, and with MiniSD, MMC and uSD/TransFlash.
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It provides a high level of ESD protection to exposed external memory card slots, efficient EMI filtering to protect data lines against RF interference, and pull-up and pull-down resistors to prevent floating data lines.
ESD protection on the card-side pins meets the stringent IEC61000-4-2 Level 4 standard, 15kV air discharge.
The 800MHz to 3GHz EMI filter achieves over 20dB attenuation at 1GHz.
In addition, six high-speed bidirectional level shifters, designed for 50MHz operation and with 3ns typical propagation delay, enable the interfacing of 2.9V memory cards with 1.8V host processors.
A maximum channel-to-channel skew of 1.5ns ensures data transmission integrity, and the drivers are optimised for low-power applications with quiescent off-current of 1uA.
Power for the memory card is provided through an on-chip 2.9V low dropout (LDO) CMOS voltage regulator, with 200mA current capability and an input voltage range of 3.1 to 5V.
The dropout voltage is 100mV maximum with a 200mA load.
A switch-off control pin, with fast 30us turn-on time, helps minimise a product's power consumption and extend battery life, and the regulator includes thermal shutdown, undervoltage lockout and short-circuit protection.
The EMIF06-SD02F3 is available in a lead-free, 24-bump, 400um pitch flip-chip, and is currently in volume production.
It is priced at US $1.10 for quantities up to 1 million units, and US $0.95 in quantities of 1 to 5 million units.
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