Product category:
IC and Hybrid Processing Equipment
News Release from: StratEdge
Edited by the Electronicstalk Editorial
Team on 28 April 2006
Seminar focuses on MMIC packaging
StratEdge, J microTechnology and Accel-RF will host a seminar on MMIC packaging, testing and reliability in San Francisco during the MTT-S trade show.
StratEdge, leader in the design and production of semiconductor packages for microwave, millimetre wave and high speed digital devices, along with J microTechnology and Accel-RF, announced they will be hosting a seminar on monolithic microwave integrated circuit (MMIC) packaging, testing and reliability on 14th June 2006 at Moscone Center in San Francisco in conjunction with the MTT-S trade show The seminar will feature three experts in packaging and testing of high frequency devices
This article was originally published on Electronicstalk on 12 Jan 2006 at 8.00am (UK)
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Jerry Carter, senior applications engineer for StratEdge, will discuss the latest package technologies and assembly techniques for microwave and millimetre wave MMICs.
Jerry Schappacher, an expert on probe technology, will discuss testing methods and probe stations for testing bare and packaged MMICs up through 65GHz.
Roland Shaw, President of Accel-RF, will discuss accelerated life-test/burn-in test systems for compound semiconductor devices, which are used in the implementation of broadband wireless infrastructures and networks.
"We are excited to be able to hold this seminar during MTT-S, which is one of the pre-eminent trade shows for microwave theory and techniques", said StratEdge president and CEO Tim Going.
"We've had many questions about how to package and test MMICs".
"The seminar offers an opportunity for engineers to see the packages and test equipment and speak to the applications engineers to better understand how to maximise the characteristics of their own MMICs".
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