Product category:
IC and Hybrid Processing Equipment
News Release from: StratEdge | Subject: Power Package series
Edited by the Electronicstalk Editorial
Team on 17 April 2007
Power Package series guards
semiconductor devices
A new line of semiconductor packages can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits.
StratEdge, a producer of semiconductor packages for microwave and high-speed digital devices has introduced its Power Package series at the RF and Hyper Trade Show in Paris, France and will show them in the United States at the MTT-S show in Honolulu, Hawaii between 5th and 7th June at booth 543 The new line of packages can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits
This article was originally published on Electronicstalk on 12 Jan 2006 at 8.00am (UK)
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Thermally conductive beryllium oxide (BeO) ceramic give the packages excellent thermal properties.
The Power Package series comes in industry-standard outlines.
Both hermetic and non-hermetic packages are available.
These packages provide superior electrical performance and incorporate copper composite bases for enhanced thermal dissipation.
Hermetic packages in this series are sealed with metal or ceramic lids that have gold-tin solder preforms.
The non-hermetic version is sealed with cup-shaped ceramic or liquid crystal polymer lids with B-stage epoxy preforms.
"The quality of a package's construction is directly proportional to the performance of the chip", explains StratEdge Senior Applications Engineer Jerry Carter, who made the announcement at the RF and Hyper Trade Show.
"Design engineers know that if they use StratEdge packages, their chips will perform to the specifications of their designs".
"We are used to creating packages that can handle high frequencies and high heat".
"For our Power Package series, we came up with a new hermetic package construction with improved reliability that still fits the industry-standard outlines".
"StratEdge has specialised in the design, manufacture, and assembly of high performance semiconductor packages for almost 20 years", says StratEdge president Tim Going.
"Several of our customers needed power packages and couldn't find anywhere else the quality, reliability, and customised services available at StratEdge".
"The way the packages are constructed is nearly identical to some of our existing package families".
"The manufacturing technology is very mature and stable".
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