Product category:
IC and Hybrid Processing Equipment
News Release from: StratEdge | Subject: Hermetic packages
Edited by the Electronicstalk Editorial
Team on 01 June 2007
Hermetic sealing becomes universal
package option
All StratEdge high-performance semiconductor packages operating from DC to above 50GHz are now available in hermetic versions.
StratEdge packages fit applications for high speed digital (OC-48, OC-192, OC-768), mixed signal, broadband wireless, satellite, point-to-point and point-to-multipoint, VSAT and test in the aerospace, telecomms, automotive and optoelectronics industries Development of a new technology which uses glass lamination and metallisation enables StratEdge to make a hermetic version of its ceramic products
This article was originally published on Electronicstalk on 18 Apr 2008 at 8.00am (UK)
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Ceramic packages mitigate brazing stresses
StratEdge's thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together.
Moulded ceramics provide leading-edge packaging
Fully hermetic true-low-profile moulded ceramic surface mount packages offer excellent electrical performance from DC to 20GHz.
Packages that are available in hermetic versions include StratEdge's LCC (low cost ceramic), SMX surface mount package, and SE50 series package.
StratEdge's moulded ceramic series packages have always been hermetic.
All packages are lead-free, meet RoHS and WEEE compliance, and are manufactured in StratEdge's ISO9001:2000 facility in San Diego, California.
Further reading
Power Package series guards semiconductor devices
A new line of semiconductor packages can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits.
Surface mount packages run up to 18GHz
Power packages have low insertion loss, good return loss and excellent thermal properties.
The LCC family of packages is designed specifically for VSAT applications.
These leaded ceramic microwave packages give excellent performance from DC to 23GHz.
Each features two or more RF leads and multiple DC leads.
The leaded construction provides easy and cost effective attachment to the next level of the system without sacrificing electrical performance so critical to microwave technology.
The SMX Series ceramic packages provide good electrical transition performance for die in the DC to 18GHz range, although they have been used and performed well in applications beyond 18GHz.
The packages provide wideband electrical performance and incorporate copper composite bases for enhanced thermal dissipation.
These are true surface mount packages that allow automated assembly and soldering for high volume production of devices while maintaining device electrical and thermal performance.
The SE50 line of packages offers standard off-the-shelf package designs working between DC and 50GHz.
They meet the stringent requirements for point-to-point and point-to-multipoint applications.
With their standard copper composite base and patented microstrip-embedded microstrip-microstrip transition design, the SE50 packages provide high electrical performance in a thermally stressful environment.
"The demand for hermetic packages for high frequency devices has increased as many new applications require a more ruggedised package that can withstand the elements and protect sensitive electronic devices", says StratEdge President Tim Going.
"It's been difficult to produce a hermetic package that protects the electrical integrity of the chip while handling the thermal requirements".
"Our new technology solves the problem".
"All StratEdge packages, whether hermetic or nonhermetic, provide extremely high performance quality and reliability".
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