Product category:
Electronics Manufacturing Materials and Consumables
News Release from: StratEdge | Subject: G1010M-2C package
Edited by the Electronicstalk Editorial
Team on 18 April 2008
Ceramic packages mitigate brazing
stresses
StratEdge's thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together.
StratEdge has released a new family of small outline thermally enhanced moulded ceramic packages for power semiconductors The new line of packages can be used for silicon, silicon carbide, gallium nitride and other compound semiconductors in power-integrated circuit applications
This article was originally published on Electronicstalk on 12 Jan 2006 at 8.00am (UK)
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Specific devices include amplifiers, discrete transistors and diodes where greater than 0.5W power is consumed.
These thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together.
All materials used in the packages have matched coefficients of expansion.
They are assembled using a glass-to-metal seal process combined with gold germanium brazing, resulting in a rugged and reliable package.
The packages can handle temperatures up to 360C.
A hermetic seal provides enhanced reliability for the device and offers protection from harsh environmental conditions, meeting military standard requirements.
Packages in this series are sealed with metal or ceramic lids that have gold-tin solder preforms.
These packages incorporate copper composite bases or copper inserts for enhanced thermal dissipation.
Devices are mounted directly to the metal bases thus providing excellent electric ground to the backside of the chip.
They provide superior electrical performance for frequencies up to at least 6GHz.
For controlled impedance devices, transition designs with higher frequency performance can be used.
Packages are available in various shapes, sizes and lead counts.
All can be provided with gull wing-shaped leads for surface mounting.
A popular package is the two-lead G1010M-2C supplied with copper insert.
The G1010M-2C has a 2.5mm2 outline with a 0.75mm x 1.4mm die attach area.
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